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Electronic Ceramics Electronic Component Sourcing High Density Rigid Flex Boards

Electronic Ceramics Electronic Component Sourcing High Density Rigid Flex Boards

Products - Electronic Component Sourcing
  • High Light

    Rigid Electronic Component Sourcing

    ,

    Electronic Ceramics Rigid Flex Boards

    ,

    High Density Rigid Flex Boards

  • Keyword
    Electronic Component Sourcing
  • Whether To Support Customization
    Support
  • Application
    Industrial Control, Medical, Automotive Electronics, Communications, Internet
  • Surface Finished
    HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
  • Special Capability
    Gold Finger Plating,Peelable,Carbon Ink
  • Min Laser Hole
    0.075mm
  • PCB Boards
    Flexible Boards, Rigid-flex Boards, Multi-layer Boards
  • Thickness
    0.5-17.5mm
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Logistics
    Accept Customer Specified Logistics
  • Materials
    FR4, High-Tg FR4, Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB+ Box
  • Delivery Time
    4 weeks
  • Supply Ability
    100000pc/Month

Electronic Ceramics Electronic Component Sourcing High Density Rigid Flex Boards

  • Electronic Ceramics Electronic Component Sourcing High Density Rigid Flex Boards
  • Electronic Ceramics Electronic Component Sourcing High Density Rigid Flex Boards
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Electronic Ceramics Electronic Component Sourcing High Density

 

Electronic Component Sourcing Introduce:
PCB and PCBA, as important components in the electronics industry, play a key role in electrical interconnection and circuit support. It is widely used in industrial control, communication modules, medical, automotive electronics, security equipment, and other industries. PCB printed circuit board provides the fixing and electrical connection of electronic components, while PCBA, as the processing process of the printed circuit board, completes the assembly and welding of components.

 

Electronic Component Sourcing Parameters:

Item Technical Parameter Min Width/Space 2.4/2.4mil
Layer 2-64 Min Outline Tolerance ±0.1mm
Thickness 0.3-6.5mm Impedance Tolerance ±5%
Copper Thickness 0.3-12 oz Min PP Thickness 0.06mm
Min Mechanical Hole 0.1mm Bow &Twist ≤0.5%
Min Laser Hole 0.075mm Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
HDI 1+n+1,2+n+2,3+n+3 Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Max Aspect Ratio 0.834027778 Special Capability Gold Finger Plating, Peelable, Carbon ink
Max Board Size 650mm*1130mm PCB boards Flexible boards, Rigid-flex boards

 

Electronic Component Sourcing Introduction:
High-density possible, Over the years, the high density of printed boards has been able to develop correspondingly with the improvement of integrated circuit integration and the advancement of mounting technology.

Electronic Ceramics Electronic Component Sourcing High Density Rigid Flex Boards 0

Tags:

High Tg FR4 Multilayer Flexible Pcb

Printed Electronic Circuit High Tg FR4

Metal Substrate Printed Electronic Circuit

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