Metal Substrate PCB Layout Design Multi-Layer Boards Producibility HASL
PCB Layout Design Description:
1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.
PCB Layout Design Parameters:
|SMT Capability||14 million spots per day|
|SMT Lines||12 SMT lines|
|Reject Rate||R&C: 0.3%|
|PCB Board||POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards|
|Parts Dimension||Min BGA Footprint:03015 Chip/0.35mm BGA|
|Parts SMT Accuracy:±0.04mm|
|IC SMT Accuracy:±0.03mm|
Q: What is the surface treatment material for PCB assembly?
Spray tin, spray tin lead-free immersion gold/tin/Silver Gold Finger Plating OSP, immersion gold + OSP
Q. What is your Minimum Order Quantity (MOQ)?
There is no limit to our MOQ, depending on the specific requirements, samples and mass production can be supported, and customized models are supported.
PCB Layout Design Introduction:
In high-speed design, the characteristic impedance of controlled impedance boards and lines is one of the most important and common problems. First understand the definition of a transmission line: A transmission line consists of two conductors of a certain length, one for sending a signal and the other for receiving a signal (remember the concept of "loop" instead of "ground"). In a multilayer board, each trace is part of a transmission line, and the adjacent reference plane can act as a second trace or return. The key to a line being a "good" transmission line is to keep its characteristic impedance constant throughout the line.