High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device
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High Tg FR4 PCB Board Design
,FR4 PCB Board Design Flexible
,PCB Multi Layer Board Electronics
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KeywordPCB Board Design
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ApplicationsAutomotive Electronics, Communications, Internet, Consumer Electronics, Battery Pack, PCBA Circuit Board
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Surface FinishedHASL Pb Free Immersion Gold/Silver Osp,Immersion Gold+OSP
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Copper Thickness0.3-12 Oz
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Min Outline Tolerance±0.1mm
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Special CapabilityGold Finger Plating, Carbon Ink
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Thickness0.5-17.5mm
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MaterialsHigh-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
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Payment MethodT/T
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Delivery Time4 Weeks
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Whether To Support CustomizationSupport
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LogisticsAccept Customer Specified Logistics
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Place of OriginCHINA
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Brand NameCUSTOM MADE
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CertificationISO/UL
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Minimum Order QuantityNegotiable
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PriceNegotiable
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Packaging DetailsPCB + Box
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Delivery Time4 weeks
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Payment TermsT/T
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Supply Ability100000pc/Month
High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device
Designability Flexible Boards PCB Board Design Electronics Device High - Tg FR4
Prototype PCB Assembly Description:
1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.
Prototype PCB Assembly Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Prototype PCB Assembly Introduction:
The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of external connections needs to be considered. Various factors such as the optimal layout of internal electronic components, the optimal layout of metal connections and vias, electromagnetic protection, heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be realized by computer-aided design (CAD).
Our products are sold all over the world, you can rest assured.