TONGZHAN INDUSTRIAL LIMITED 86--18088883067 nick.cheng@tongzhanpcb.com
FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862

FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862

  • High Light

    FPC Prototype Pcb Manufacturing

    ,

    Prototype Pcb Manufacturing Through Hole TU862

    ,

    Through Hole Multilayer Board Assembly TU862

  • Features
    High Reliability, Designability, Producibility
  • Keyword
    Prototype PCB Assembly
  • Materials
    High-Tg FR4, RCC, PTFE, TU862, TU872
  • Min Width/Space
    2.4/2.4mil
  • Surface Finished
    Immersion Gold+OSP, HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp
  • Bow & Twist
    ≤0.5%
  • Applications
    Automotive Electronics, Communications
  • PCB Board
    Multilayer Boards, Metal Base Boards
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862

FPC Boards Prototype PCB Assembly Carbon Ink Through Hole Assembly TU862

 

Prototype PCB Assembly Description:

1. From prototype to production.

2. 2-68 layers board fabrication.

3. TPS Lean production and high reliability.

4. IATF16949, UL certification.

 

Prototype PCB Assembly Parameters:

SMT Capability 14 million spots per day
SMT Lines 12 SMT lines
Reject Rate R&C: 0.3%
IC: 0%
PCB Board POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards
Parts Dimension Min BGA Footprint:03015 Chip/0.35mm BGA
Parts SMT Accuracy:±0.04mm
IC SMT Accuracy:±0.03mm
PCB Dimension Size:50*50mm-686*508mm
Thickness: 0.3-6.5mm


Prototype PCB Assembly Introduction:

1. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures electronic products. quality, improve labor productivity, reduce costs, and facilitate maintenance.
2. Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.
3. The printed board with passive components embedded inside provides certain electrical functions, simplifies the electronic installation procedure, and improves the reliability of the product.
4. In large-scale and ultra-large-scale electronic packaging components, an effective chip carrier is provided for the miniaturized chip packaging of electronic components.

 

FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862 0