TONGZHAN INDUSTRIAL LIMITED 86--18088883067 nick.cheng@tongzhanpcb.com
POP Board Pcb Fab Services TU862 Industrial

POP Board Pcb Fab Services TU862 Industrial

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    POP Board Pcb Fab Services

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    Pcb Fab Services TU862

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    TU862 Printed Circuit Board Fabrication

  • Keyword
    Printed Circuit Board Fabrication
  • PCB Assembly
    Turnkey Assembly, Hybrid Technology (SMT/Through Hole)
  • Applications
    Electronics Device, Consumer Electronics, Electronical Products, PCBA Circuit Board, Industrial Control
  • Surface Finished
    Immersion Gold+OSP
  • PCB Boards
    HDI Board, Rigid-flex Joint Board
  • Materials
    FR4, High-Tg FR4, Rogers, RCC, PTFE, TU862, TU872
  • Min Laser Hole
    0.075mm
  • Max Board Size
    650mm*1130mm
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

POP Board Pcb Fab Services TU862 Industrial

Quick Turn To Prototype Printed Circuit Board Fabrication TU862 POP Board
 
Printed Circuit Board Fabrication Description:
1. A team of experts with more than 10 years of experience.
2. Professional component certified engineers and experienced supply chain management team.
3. Pay attention to the latest international market information and provide competitive prices.
4. Certified suppliers and parts.


Printed Circuit Board Fabrication Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.3-6.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink

 
FAQ:
Q. What is your Minimum Order Quantity (MOQ)?
There is no limit to our MOQ, depending on the specific requirements, samples and mass production can be supported, and customized models are supported.

 
Q: What are the payment terms we can accept?
We recommend that you use T/T, and other needs can be communicated with our staff.


Printed Circuit Board Fabrication Introduction:
1. Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.
2. The printed board with passive components embedded inside provides certain electrical functions, simplifies the electronic installation procedure, and improves the reliability of the product.
3. In large-scale and ultra-large-scale electronic packaging components, an effective chip carrier is provided for the miniaturized chip packaging of electronic components.
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