TONGZHAN INDUSTRIAL LIMITED 86--18088883067 nick.cheng@tongzhanpcb.com
Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb

Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb

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    Conformal Coating PCB Fabrication

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    PCB Fabrication High Multilayer

    ,

    High Multilayer Rigid Flex Pcb

  • Keyword
    Printed Circuit Board Fabrication
  • Applications
    Battery Pack, PCBA Circuit Board, Industrial Control
  • Surface Finished
    HASL, Immersion Gold+OSP
  • PCB Assembly
    Consignment Assembly, Hybrid Technology (SMT/Through Hole)
  • PCB Boards
    Ordinary Board, HDI Board, Rigid-flex Joint Board
  • HDI
    1+n+1、2+n+2、3+n+3
  • Max Aspect Ratio
    20:01
  • Min Width/Space
    2.4/2.4mil
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb

Conformal Coating Printed Circuit Board Fabrication High Multilayer
 
Printed Circuit Board Fabrication Description:
1. Quick-turn and flexible delivery.
2. Support a wide range of PCBs: high-layer, multi-layer, rigid-flex, high frequency, high speed, etc.
3. Professional supplier positioning.
4. Seamless link from prototype to mass production.
5. Whole-flow quality assurance, IPC, Special industry inspection standard.
 
Printed Circuit Board Fabrication Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.3-6.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink

 
Printed Circuit Board Fabrication Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.
Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb 0