TONGZHAN INDUSTRIAL LIMITED 86--18088883067 nick.cheng@tongzhanpcb.com
Carbon Ink Printed Circuit Board Fabrication Embedded Resistor Smd Assembly Service

Carbon Ink Printed Circuit Board Fabrication Embedded Resistor Smd Assembly Service

  • High Light

    Embedded Resistor Smd Assembly Service

    ,

    Carbon Ink Printed Circuit Board Fabrication

    ,

    OSP Printed Circuit Board Fabrication

  • Keyword
    Printed Circuit Board Fabrication
  • Applications
    Battery Pack, PCBA Circuit Board
  • Surface Finished
    HASL, Immersion Gold+OSP
  • PCB Boards
    HDI Board, FPC Board, Flexible Board
  • PCB Assembly
    Through Hole Assembly, Consignment Assembly
  • Special Capability
    Gold Finger Plating, Carbon Ink
  • Impedance Tolerance
    ±5%
  • Min PP Thickness
    0.06mm
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

Carbon Ink Printed Circuit Board Fabrication Embedded Resistor Smd Assembly Service

Carbon Ink Printed Circuit Board Fabrication Conformal Coating Embedded Resistor

 

Printed Circuit Board Fabrication Description:
PCB products not only facilitate the standardized assembly of various components but also enable automated and large-scale mass production. In addition, the overall assembly of the PCB and various other components can also form larger components, systems, and even complete machines.
Since the components of PCB products and various components are assembled in a standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently, and flexibly, and the work of the system can be quickly restored.

 

Printed Circuit Board Fabrication Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.3-6.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink

 

Printed Circuit Board Fabrication Introduction:

1. Provide mechanical support for fixing and assembling various electronic components such as integrated circuits, realize wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provide required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide identification characters and graphics for component insertion, inspection, and maintenance.
3. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures electronic products. quality, improve labor productivity, reduce costs, and facilitate maintenance.
4. Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.

Carbon Ink Printed Circuit Board Fabrication Embedded Resistor Smd Assembly Service 0