Gold Finger Plating Printed Circuit Board Fabrication Through Hole Assembly
Printed Circuit Board Fabrication Description:
PCB products not only facilitate the standardized assembly of various components but also enable automated and large-scale mass production. In addition, the overall assembly of the PCB and various other components can also form larger components, systems, and even complete machines.
Since the components of PCB products and various components are assembled in a standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently, and flexibly, and the work of the system can be quickly restored.
Printed Circuit Board Fabrication Parameters:
|SMT Capability||14 million spots per day|
|SMT Lines||12 SMT lines|
|Reject Rate||R&C: 0.3%|
|PCB Board||POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards|
|Parts Dimension||Min BGA Footprint:03015 Chip/0.35mm BGA|
|Parts SMT Accuracy:±0.04mm|
|IC SMT Accuracy:±0.03mm|
Printed Circuit Board Fabrication Introduction:
1. Provide mechanical support for fixing and assembling various electronic components such as integrated circuits, realize wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provide required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide identification characters and graphics for component insertion, inspection, and maintenance.
3. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures electronic products. quality, improve labor productivity, reduce costs, and facilitate maintenance.
4. Provide the required electrical characteristics, characteristic impedance and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.