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IC SMT Printed Circuit Board Fabrication Gold Finger Plating Through Hole PCB Assembly

IC SMT Printed Circuit Board Fabrication Gold Finger Plating Through Hole PCB Assembly

  • High Light

    IC SMT Printed Circuit Board Fabrication

    ,

    Printed Circuit Board Fabrication Gold Finger Plating

    ,

    IC SMT Through Hole PCB Assembly

  • Keyword
    Printed Circuit Board Fabrication
  • Applications
    Electronical Products, Battery Pack, PCBA Circuit Board
  • PCB Boards
    HDI Board, FPC Board
  • Surface Finished
    Immersion Gold+OSP, HASL
  • Special Capability
    Gold Finger Plating, Carbon Ink
  • PCB Assembly
    Through Hole Assembly, Consignment Assembly
  • Min Laser Hole
    0.075mm
  • Copper Thickness
    0.3-12 Oz
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

IC SMT Printed Circuit Board Fabrication Gold Finger Plating Through Hole PCB Assembly

Gold Finger Plating Printed Circuit Board Fabrication Through Hole Assembly

 

Printed Circuit Board Fabrication Description:
1. Assemblability
PCB products not only facilitate the standardized assembly of various components but also enable automated and large-scale mass production. In addition, the overall assembly of the PCB and various other components can also form larger components, systems, and even complete machines.
2. Maintainability
Since the components of PCB products and various components are assembled in a standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently, and flexibly, and the work of the system can be quickly restored.

 

Printed Circuit Board Fabrication Parameters:

SMT Capability 14 million spots per day
SMT Lines 12 SMT lines
Reject Rate R&C: 0.3%
IC: 0%
PCB Board POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards
Parts Dimension Min BGA Footprint:03015 Chip/0.35mm BGA
Parts SMT Accuracy:±0.04mm
IC SMT Accuracy:±0.03mm
PCB Dimension Size:50*50mm-686*508mm
Thickness: 0.3-6.5mm

 

Printed Circuit Board Fabrication Introduction:

1. Provide mechanical support for fixing and assembling various electronic components such as integrated circuits, realize wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provide required electrical characteristics.
2. Provide solder mask graphics for automatic welding, and provide identification characters and graphics for component insertion, inspection, and maintenance.
3. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures electronic products. quality, improve labor productivity, reduce costs, and facilitate maintenance.
4. Provide the required electrical characteristics, characteristic impedance and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.

IC SMT Printed Circuit Board Fabrication Gold Finger Plating Through Hole PCB Assembly 0