High - Tg FR4 Printed Circuit Board Fabrication Through Hole Assembly
Printed Circuit Board Fabrication Description:
PCB products not only facilitate the standardized assembly of various components but also enable automated and large-scale mass production. In addition, the overall assembly of the PCB and various other components can also form larger components, systems, and even complete machines.
Since the components of PCB products and various components are assembled in a standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently, and flexibly, and the work of the system can be quickly restored.
Printed Circuit Board Fabrication Parameters:
|SMT Capability||14 million spots per day|
|SMT Lines||12 SMT lines|
|Reject Rate||R&C: 0.3%|
|PCB Board||POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards|
|Parts Dimension||Min BGA Footprint:03015 Chip/0.35mm BGA|
|Parts SMT Accuracy:±0.04mm|
|IC SMT Accuracy:±0.03mm|
Printed Circuit Board Fabrication Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.