TONGZHAN INDUSTRIAL LIMITED 86--18088883067 nick.cheng@tongzhanpcb.com
High Tg FR4 Printed Circuit Board Fabrication TU862 Through Hole Assembly

High Tg FR4 Printed Circuit Board Fabrication TU862 Through Hole Assembly

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    TU862 Printed Circuit Board Fabrication ptfe

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    Printed Circuit Board Fabrication TU862

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    TU862 Through Hole Assembly

  • Keyword
    Printed Circuit Board Fabrication
  • Applications
    Electronical Products, Communications, Internet
  • PCB Boards
    HDI Board, FPC, Rigid-flex Joint Board
  • Special Capability
    Gold Finger Plating, Carbon Ink
  • Bow & Twist
    ≤0.5%
  • Surface Finished
    Immersion Gold+OSP, HASL
  • Materials
    High-Tg FR4, TU862
  • PCB Assembly
    Through Hole Assembly, SMT/SMD Assembly
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

High Tg FR4 Printed Circuit Board Fabrication TU862 Through Hole Assembly

High - Tg FR4 Printed Circuit Board Fabrication Through Hole Assembly

 

Printed Circuit Board Fabrication Description:
1. Assemblability
PCB products not only facilitate the standardized assembly of various components but also enable automated and large-scale mass production. In addition, the overall assembly of the PCB and various other components can also form larger components, systems, and even complete machines.
2. Maintainability
Since the components of PCB products and various components are assembled in a standardized design and large-scale production, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently, and flexibly, and the work of the system can be quickly restored.

 

Printed Circuit Board Fabrication Parameters:

SMT Capability 14 million spots per day
SMT Lines 12 SMT lines
Reject Rate R&C: 0.3%
IC: 0%
PCB Board POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards
Parts Dimension Min BGA Footprint:03015 Chip/0.35mm BGA
Parts SMT Accuracy:±0.04mm
IC SMT Accuracy:±0.03mm
PCB Dimension Size:50*50mm-686*508mm
Thickness: 0.3-6.5mm

 

Printed Circuit Board Fabrication Introduction:

The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.High Tg FR4 Printed Circuit Board Fabrication TU862 Through Hole Assembly 0