2 - 68 Layers Printed Circuit Board Fabrication Rigid - Flex Joint Board Back Drill
Printed Circuit Board Fabrication Description:
1. A team of experts with more than 10 years of experience.
2. Professional component certified engineers and experienced supply chain management team.
3. Pay attention to the latest international market information and provide competitive prices.
4. Certified suppliers and parts.
Printed Circuit Board Fabrication Parameters:
|Copper Thickness||0.3-12 oz|
|Min Mechanical Hole||0.1mm|
|Min Laser Hole||0.075mm|
|Max Aspect Ratio||20:01|
|Max Board Size||650mm*1130mm|
|Min Outline Tolerance||±0.1mm|
|Min PP Thickness||0.06mm|
|Materials||FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872|
|Surface Finished||HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP|
|Special Capability||Gold Finger Plating, Peelable, Carbon ink|
Printed Circuit Board Fabrication Introduction:
1. High reliability
Through a series of technical means such as inspection, testing, and aging tests, the PCB can be guaranteed to work reliably for a long time (usually 20 years).
Requirements for various properties of PCB (electrical, physical, chemical, mechanical, etc.) can be achieved through design standardization, normalization, etc. In this way, the design time is short and the efficiency is high.