Printed Circuit Board Fabrication HDI Board High - Tg FR4 12 SMT Lines
Printed Circuit Board Fabrication Description:
1. A team of experts with more than 10 years of experience.
2. Professional component certified engineers and experienced supply chain management team.
3. Pay attention to the latest international market information and provide competitive prices.
4. Certified suppliers and parts.
Printed Circuit Board Fabrication Parameters:
|Copper Thickness||0.3-12 oz|
|Min Mechanical Hole||0.1mm|
|Min Laser Hole||0.075mm|
|Max Aspect Ratio||20:01|
|Max Board Size||650mm*1130mm|
|Min Outline Tolerance||±0.1mm|
|Min PP Thickness||0.06mm|
|Materials||FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872|
|Surface Finished||HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP|
|Special Capability||Gold Finger Plating, Peelable, Carbon ink|
Printed Circuit Board Fabrication Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.