Electronic Component Sourcing M6 Communication Equipment Multi-Layer
Electronic Component Sourcing Description:
1. Provide high multilayer PCB manufacturing service
2. 2-68 layers of samples can be provided for mass production
3. Ordinary board/HDI board/FPC/rigid-flex joint board/metal base plate
PCB Manufacturing Parameters:
|SMT Capability||14 million spots per day|
|SMT Lines||12 SMT lines|
|Reject Rate||R&C: 0.3%|
|PCB Board||POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards|
|Parts Dimension||Min BGA Footprint:03015 Chip/0.35mm BGA|
|Parts SMT Accuracy:±0.04mm|
|IC SMT Accuracy:±0.03mm|
Q: What are the benefits of choosing us?
1. We focus on your needs
The growing needs of our customers drive our continued growth. The growth management of our PCB layout, fabrication, assembly and materials is driven by continued pressure to reduce time to market and keep pace with emerging technologies. Co-exhibition capabilities allow our clients to focus on their core competencies such as R&D and sales and marketing.
2. You will benefit from our experience
Most of the staff at the same exhibition have more than 4 years of experience in PCB design, manufacturing, assembly and parts procurement. We handle over 2,000 cases each year.
Q: What is the surface treatment material for PCB assembly?
Spray tin, spray tin lead-free immersion gold/tin/Silver Gold Finger Plating OSP, immersion gold + OSP
Electronic Component Sourcing Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.