Immersion Gold + OSP Electronic Component Sourcing 0.5 - 17.5mm Thickness Nelco
Electronic Component Sourcing Description:
The PCB assembly we produce includes rapid turn prototype PCB assembly, SMT/SMD assembly, through-hole assembly, hybrid technology (SMT/through-hole), turnkey assembly, consignment assembly, etc. They are widely used in industrial control, medical care, automotive electronics, communications, and the Internet. SMT, post welding, assembly to testing one-stop service supports flexible supply.
PCB Manufacturing Parameters:
|Copper Thickness||0.3-12 oz|
|Min Mechanical Hole||0.1mm|
|Min Laser Hole||0.075mm|
|Max Aspect Ratio||20:01|
|Max Board Size||650mm*1130mm|
|Min Outline Tolerance||±0.1mm|
|Min PP Thickness||0.06mm|
|Materials||FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872|
|Surface Finished||HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP|
|Special Capability||Gold Finger Plating, Peelable, Carbon ink|
Electronic Component Sourcing Introduction:
All of the components we buy are from original manufacturers or A-level dealers, which means that we will never use old parts, updated parts or parts with old date codes. Full process quality assurance, IPC, and special industry inspection standards.