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POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

Products - Prototype PCB Assembly
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    POP Prototype PCB Assembly rcc

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    Prototype PCB Assembly 12 SMT ptfe

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    POP Multilayer Rf Pcb Design

  • Keyword
    Prototype PCB Assembly
  • Applications
    Industrial Control, Medical Care, Automotive Electronics, Communications, Interne
  • PCB Board
    POP Boards, Normal Boards, FPC Boards, Rigid-flex Boards, Metal Base Boards
  • Special Capability
    Gold Finger Plating,Peelable,Carbon Ink
  • SMT Lines
    12 SMT Lines
  • Surface Finished
    HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp,Immersion Gold+OSP
  • Materials
    FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
  • Min PP Thickness
    0.06mm
  • Payment Method
    T/T
  • Delivery Time
    4 Weeks
  • Whether To Support Customization
    Support
  • Logistics
    Accept Customer Specified Logistics
  • Place of Origin
    CHINA
  • Brand Name
    CUSTOM MADE
  • Certification
    ISO/UL
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    PCB + Box
  • Delivery Time
    4 weeks
  • Payment Terms
    T/T
  • Supply Ability
    100000pc/Month

POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design

  • POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design
  • POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design
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Prototype PCB Assembly Supports Rigid 12 SMT Lines 0.3 - 6.5mm Thickness

 

Prototype PCB Assembly Description:

1. Quick-turn prototype PCB assembly.
2. SMT/SMD assembly.
3. Thru-hole assembly.
4. Mixed Technology (SMT/Thru-hole).
5. Turn-key assembly.
6. Consignment assembly.
7. RoHS-compliant lead-free assembly / Non-RoHS assembly.


Prototype PCB Assembly Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.5-17.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink


Prototype PCB Assembly Introduction:

The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.

POP Prototype PCB Assembly Supports Rigid 12 SMT Lines Multilayer Rf Pcb Design 0

Tags:

Immersion Gold OSP Electronics Pcb Assembly

0.04mm SMT PCB Prototype Service

Metal Baseboards Prototype PCB Assembly

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