The Half Hole Car Core Multilayer PCB is a high-precision interconnect solution specifically engineered for the rigorous demands of automotive electronic control units (ECUs) and core vehicle systems. Utilizing high-performance TG170 High Tg FR4 material, this 6-layer board is designed to withstand extreme thermal fluctuations and mechanical stress common in automotive environments, ensuring long-term reliability and signal integrity.
Featuring advanced half-hole technology with a 0.5mm pore size, this PCB optimizes space efficiency and enhances structural stability for surface-mount components. With a precision trace/space width of 4mil and professional immersion gold surface treatment, it provides superior conductivity and oxidation resistance, making it an ideal choice for critical automotive electronics where failure is not an option.
| Model | Half Hole Car Core Multilayer PCB | Material | TG170 High Tg FR4 |
|---|---|---|---|
| Layer Count | 6 Layers | Finished Thickness | 0.8mm |
| Inner Copper | 1OZ | Outer Copper | 0.5OZ |
| Surface Finish | Immersion Gold | Min Trace/Space | 4mil(0.1mm) / 4mil(0.1mm) |
| Half Hole Size | 0.5mm | Available Colors | Green / White |
TG170 High Tg FR4 prevents delamination and maintains mechanical strength under high-temperature automotive operating conditions.
Immersion gold treatment provides excellent corrosion resistance and extends the lifespan of the board in harsh environments.
0.5mm half-hole design allows for denser component placement and improved mechanical anchoring for critical parts.
The 6-layer multilayer architecture minimizes electromagnetic interference (EMI) and optimizes high-speed signal routing.
A finished thickness of 0.8mm enables integration into tight automotive housings without sacrificing performance.
4mil trace and space precision ensures high-density interconnects suitable for complex automotive electronic circuits.
Full batch tracking for all automotive-grade raw materials including TG170 FR4 substrates.
CNC-controlled half-hole drilling ensures micron-level accuracy for consistent board quality.
Integrated AOI and E-test systems ensure zero-defect delivery for critical car core PCBs.
Strict adherence to RoHS and REACH standards for global automotive market requirements.
Just-in-time delivery models to reduce lead times for automotive assembly lines.
Direct engineering access for DFM (Design for Manufacturing) optimization of multilayer boards.
| Performance Metric | Standard PCB | Car Core Half-Hole PCB | ROI Impact |
|---|---|---|---|
| Thermal Limit | 130°C – 140°C | 170°C (High Tg) | Reduced Field Failures |
| Component Density | Medium | Ultra-High (Half-Hole) | Smaller Module Size |
| Solder Reliability | Standard HASL | Immersion Gold (ENIG) | Superior Joint Life |
| Signal Noise | Standard Layering | Optimized 6-Layer | Higher System Stability |
| Lifecycle Cost | Frequent Replacement | Long-term Durability | Lower Maintenance Cost |
TG170 material provides a higher glass transition temperature, preventing the board from softening or delaminating during extreme heat cycles found in vehicle engine compartments or high-load electronic modules.
Half-holes provide superior mechanical stability and allow for precise component positioning in space-constrained environments, reducing the risk of component shift during vehicle vibration.
Yes, immersion gold (ENIG) offers a flat surface for precise SMT and provides excellent oxidation resistance, which is vital for the longevity of electronic components in automotive settings.
Absolutely. The 6-layer structure allows for dedicated ground and power planes, which significantly reduces crosstalk and electromagnetic interference, supporting high-speed signals.
Our manufacturing process supports a minimum trace width and space of 4mil (0.1mm), allowing for high-density circuit designs without compromising reliability.
The 0.8mm thickness provides a balance between structural rigidity and a slim profile, enabling the PCB to fit into compact automotive electronic housings efficiently.
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PCB type: Rigid PCB
Layer: Multi-layer
Base material: FR-4
Solder mask: Green
Silk screen: White
Surface treatment: HASL
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