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Welcome to our factory - PCB Capabilities!
About PCB Capabilities, we take pride in providing top-notch printed circuit board manufacturing and assembly services to meet all your needs. Our factory boasts advanced production facilities and a highly specialized team dedicated to offering the highest quality PCB solutions for our customers.
Our core capabilities include:
PCB Manufacturing: With state-of-the-art PCB manufacturing equipment and processes, we can produce single-sided, double-sided, and multi-layer PCBs to meet various levels of complexity and requirements. We strictly adhere to international standards to ensure each PCB exhibits excellent quality and reliability.
Surface Mount Technology (SMT) Assembly: Our SMT production line employs advanced automated equipment to efficiently and accurately assemble various sizes and types of surface mount components. From small-scale components to BGA packages, we are well-equipped to guarantee assembly quality.
Through-Hole Component Soldering: For projects requiring through-hole components, we possess specialized expertise and equipment to ensure every soldering point is robust and reliable, ensuring stability and durability during long-term use.
Functional Testing and Quality Control: Our factory is equipped with advanced testing equipment and stringent quality control procedures to ensure each PCB undergoes comprehensive functional testing, meeting our customer's specification requirements.
Quick Turnaround: We understand the importance of time for your projects. With efficient production capabilities and flexible scheduling, we ensure your PCB orders are delivered on time.
At PCB Capabilities, customer satisfaction is our priority. We always keep customer needs at the forefront, offering customized solutions to support your project from conception to realization.
No matter the scale of your project or your PCB requirements, we are dedicated to providing you with top-quality service and highly reliable PCB products. Feel free to contact us and let our professional team deliver the best PCB solutions for you!
| Technical parameters | |
| Plate | Process parameters |
| Number of layers | Floors 2-68 |
| Board thickness | 0.5-17.5mm |
| Finished copper thickness | 0.3-12 oz |
| Minimum mechanical aperture | 0.1mm |
| Minimum laser aperture | 0.075mm |
| HDI type | 1+n+1,2+n+2,3+n+3 |
| Maximum plate thickness aperture ratio | 0.834027778 |
| Maximum board size | 650mm*1130mm |
| Minimum line width/line spacing | 2.4/2.4mil |
| Minimum form factor tolerance | ±0.1mm |
| Minimum impedance tolerance | ±5% |
| Minimum insulation thickness | 0.06mm |
| Warpage | ≤0.5% |
| Plate | FR4,Hi-Tg FR4,Rogers,Nelco,RCC,PTFE M4,M6,TU862,TU872,IT170GRA1,IT968 |
| Surface treatment | Tin spray HASL, lead-free tin spray HASL Pb Free gold immersion, tin immersion, silver immersion, gold plating, OSP, gold immersion + OSP |
| Special processes | Buried blind holes, step grooves, metal substrates, buried resistance, mixed pressure, soft and hard combination, back drilling, gold finger |
Contact Person: Mr. NICK CHENG
Tel: +86-18088883067