Printed Circuit Board (PCB) Fabrication is a crucial process in the electronics industry that involves the manufacturing of PCBs, which serve as the fundamental platform for electronic circuits in various devices and systems. The fabrication process transforms raw materials into precisely engineered PCBs that provide electrical connectivity and mechanical support for electronic components.
The PCB fabrication process begins with designing the PCB layout using specialized computer-aided design (CAD) software. Designers determine the arrangement of copper traces, pads, and vias that form the electrical connections and pathways for the components. They also specify the number of layers and overall dimensions of the PCB based on the complexity of the circuit and space constraints.
The next step is to produce the PCB's physical board using a substrate material, typically fiberglass-reinforced epoxy resin known as FR4. The substrate is coated with a thin layer of copper on both sides, forming the conductive layers that make up the PCB.
To create the desired circuit pattern, a layer of photosensitive material called the resist is applied to the copper-coated substrate. The PCB layout data is then used to expose the resist to ultraviolet light, hardening the exposed areas.
After the exposure, the unexposed resist is removed, leaving behind the desired copper traces and pads. The exposed copper is then chemically etched away, precisely defining the circuit pattern on the PCB.
For multilayer PCBs, the process is repeated to create multiple conductive layers. The individual layers are then laminated together under high pressure and temperature to form a single, compact unit.
Next, holes for through-hole components and vias are drilled into the PCB. These holes are plated with a conductive material to establish electrical connections between the different layers of the PCB.
After drilling and plating, the PCB is coated with a protective solder mask. This solder mask covers the entire PCB surface except for the exposed copper pads, preventing solder from flowing where it is not required during the assembly process.
Finally, the PCB undergoes surface finish treatment, such as electroless nickel immersion gold (ENIG), hot air solder leveling (HASL), or immersion tin, to enhance its solderability and protect the copper from oxidation.
PCB fabrication is a critical step in the electronics manufacturing process, ensuring the creation of reliable and high-quality PCBs that form the foundation for electronic devices and systems across various industries. With continuous advancements in fabrication techniques and materials, PCBs continue to play a pivotal role in shaping the future of electronics and driving innovation in a wide range of applications.
Payment & Shipping Terms:
|Keyword:||Printed Circuit Board Fabrication||Insulation:||FR4 Board, Aluminum Substrate, Copper Substrate, Ceramic Substrate, PI (polycumimine), PET (poly)|
|Copper Foil Material:||Glue-free Calendered Copper, Rubber-rolled Copper, Glue-based Electrolytic Copper||Number:||1-12 Floors|
|The Finished Board Is Thick:||0.07MM AND ABOVE (TOLERANCE +5%)||The Inner Layer Is Thick Copper:||18-7OUM (1 Ounce Copper = 35UM)|
|The Outer Layer Is Thick Copper:||20-14OUM (1 Plate Copper = 35UM)||Solder Mask:||Red Oil, Green Oil, Butter, Blue Oil, White Oil, Black Oil, Matte Black Oil, Yellow Film Covered White Film, Black Film|
|Word:||Red, Green, Yellow, Blue, White, Black Silver||Surface Treatment:||Anti-oxidation (OSP), Tin Spraying, Gold Immersion, Gold Plating, Silver Plating Nickel Plating, Gold Plating Finger, Carbon Oil|
|Special Processes:||Thick Copper Plate, Impedance Plate, High Frequency Plate, Half-hole Plate, Orifice Plate, Hollow Plate, Single-layer Copper Foil, Cross-sided Gold Finger Plate, Soft And Hard Combination||Reinforcement Type:||PI, FR4, Steel Sheet, 3M Glue, Electromagnetic Shielding Film|
|Maximum Size:||50OMM*1000MM||Outer Line Width/line Spacing:||0.065MM( 3MIL)|
|Inner Line Width/line Spacing:||0.065MM(3MIL)||Minimum Solder Mask Width:||0.10MM|
|Minimum Mask Bridge Width:||0.05MM||Minimum Solder Mask:||0.45MM|
|Minimum Aperture:||MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM||Impedance Tolerance:||10% Of Soil|
|Form Tolerances:||+0.05MM(LASER+0.005MM)||Molding Method:||V-cut, CNC, Die Punching, Laser|
Elevate Your Electronics with Customized PCB Production Services
Innovative PCB Fabrication For Unsurpassed Quality And Flexibility
Key Steps In Printed Circuit Board Manufacturing:
1. Design: First, circuit board designers create circuit diagrams and layouts using computer-aided design (CAD) tools. This includes determining component locations, connections, and circuit paths.
2. Substrate Preparation: Non-conductive substrates are typically made from fiberglass-reinforced epoxy resin. These substrates are subsequently processed through cutting and lamination processes.
3. Conductive layer deposition: Deposition of conductive material (usually copper) on the surface of a substrate to form a circuit pattern. This can be done through chemistry, electroplating, or other techniques.
Patterning: Using photolithography or etching to remove unwanted portions of a conductive layer, leaving the desired circuit pattern.
4. Component placement: Use automated equipment to accurately place electronic components such as resistors, capacitors, and integrated circuits onto circuit boards.
5. Soldering: Components and circuit boards are connected through a soldering process. This can be done using surface-mount technology (SMT) or through-mount technology (THT).
6. Testing and Quality Control: Once completed, the board goes through a series of tests to ensure that all components are connected correctly and the circuit is working properly. The quality control process also includes visual inspection and measurement.
Printed Circuit Board Fabrication Parameters:
Printed Circuit Board Fabrication
PI, FR4, steel sheet, 3M glue, the electromagnetic shielding film
FR4 board, aluminum substrate, copper substrate, a ceramic substrate, PI (polycumimine), PET (poly)
Copper foil material
Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper
Outer line width/line spacing
Inner line width/line spacing
The finished board is thick
0.07MM AND ABOVE (TOLERANCE +5%)
Minimum solder mask width
The inner layer is thick copper
18-7OUM (1 ounce copper = 35UM)
Minimum mask bridge width
The outer layer is thick copper
20-14OUM (1 plate copper = 35UM)
Minimum solder mask
Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film
MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM
Red, green, yellow, blue, white, black silver
10% of soil
Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil
Thick copper plate, impedance plate, high-frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination
V-cut, CNC, die punching, laser
Printed Circuit Board Fabrication Factory Introduction:
Tongzhan Industrial Ltd. was established in 2011 in Shenzhen, Guangdong Province. Tongzhan Industrial Ltd. is committed to becoming a leading one-stop EMS supplier company, providing customers with high-quality PCB series products. Tongzhan mainly focuses on high-speed turnkey PCB layout design and PCB assembly services, including PCB design, manufacturing, component procurement, PCBA design and board making, supply chain services, functional testing, conformal paint, complete assembly, etc. Our corporate culture is to serve customers, customers always come first. Customer-oriented, diligent and innovative, honest, happy, transparent, customer-centric, professional, efficient, and win-win. Our employees are passionate. Passion for Science. Passion for technology.
Contact Person: Mr. NICK CHENG