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Product Details: |
| Technical parameters | |
| Plate | Process parameters |
| Number of layers | Floors 2-68 |
| Board thickness | 0.5-17.5mm |
| Finished copper thickness | 0.3-12 oz |
| Minimum mechanical aperture | 0.1mm |
| Minimum laser aperture | 0.075mm |
| HDI type | 1+n+1,2+n+2,3+n+3 |
| Maximum plate thickness aperture ratio | 0.834027778 |
| Maximum board size | 650mm*1130mm |
| Minimum line width/line spacing | 2.4/2.4mil |
| Minimum form factor tolerance | ±0.1mm |
| Minimum impedance tolerance | ±5% |
| Minimum insulation thickness | 0.06mm |
| Warpage | ≤0.5% |
| Plate | FR4,Hi-Tg FR4,Rogers,Nelco,RCC,PTFE M4,M6,TU862,TU872,IT170GRA1,IT968 |
| Surface treatment | Tin spray HASL, lead-free tin spray HASL Pb Free gold immersion, tin immersion, silver immersion, gold plating, OSP, gold immersion + OSP |
| Special processes | Buried blind holes, step grooves, metal substrates, buried resistance, mixed pressure, soft and hard combination, back drilling, gold finger |
Contact Person: Train Long
Tel: +8618088883067
