As an important support for the electronic information industry, the technical development of the PCB industry usually needs to adapt to the needs of downstream electronic terminal equipment. At present, electronic products mainly show two obvious trends: one is light, thin, and small, and the other is high speed and high frequency. The application requirements of downstream industries have put forward higher requirements for the precision and stability of PCB. The PCB industry will move towards high Development in the direction of density and high performance.
High density is an important direction for the development of printed circuit board technology in the future, and higher requirements are put forward for the size of the circuit board aperture, wiring width, and the number of layers; high-density interconnection technology (HDI) is today's advanced PCB technology The embodiment of the method is to reduce the number of through holes by accurately setting blind and buried holes, save the area that can be routed on the PCB, and greatly increase the density of components; high performance is mainly aimed at the performance requirements of PCB impedance and heat dissipation. The wiring length of the high-level PCB board is short, the circuit impedance is low, it can work at high frequency and high speed with stable performance, and it can undertake more complex functions, which is also the key to enhancing product reliability. Therefore, downstream industries put forward higher requirements for the reliability and stability of PCB products, and at the same time, the application proportion of HDI boards with higher density in future electronic products will gradually expand.
