Huaswin Electronics Co.,Limited

Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China 

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Aluminum based Chip On Board Assembly for LCD display PCB Assembly Board

PCB Certifications
Good quality PCB Board Assembly
Good quality PCB Board Assembly
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Chip On Board Assembly

  • High Precision Chip On Board Assembly suppliers

Product name: Chip on Board PCBA Boards
Layers: 2L 
Thickness: 0.2mm 
Copper finished: 0.5
Process description: SMT+COB
The smallest components package: 0201
RoHS standard: Yes

Chip On Board Assembly Sample Introduction

Aluminum based Chip On Board Assembly for LCD display PCB Assembly Board

China Aluminum based Chip On Board Assembly for LCD display PCB Assembly Board Supplier

Large Image :  Aluminum based Chip On Board Assembly for LCD display PCB Assembly Board

Product Details:

Place of Origin: China
Brand Name: HUASWIN
Certification: ISO/UL/RoHS
Model Number: HSPCBA1005

Payment & Shipping Terms:

Minimum Order Quantity: 1 sets
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 15-20 working days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
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Detailed Product Description

 

Aluminum based Chip On Board Assembly for LCD display PCB Assembly Board
 
 
PCB capability and services: 


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers) 
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 
 
 
Detailed Specification of PCB Manufacturing
 

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, 
Aluminum-based material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, 
OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

 
 
Detailed Specification of Pcb Assembly
 

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials 

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days 

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test

 
 
Chip On Board Assembly Quality Processes: 


1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
 
 
Testing:  


AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming

Contact Details
Huaswin Electronics Co.,Limited

Contact Person: Ms. Vicky Lee

Tel: +8613632657851

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