15 years experience PCB/PCBA manufacturing
customized turnkey solutions
OEM & ODM avaiable
Short lead time & high quality
Surface Mount And Through-Hole Assemblies
Small To Large Volume Production
Prototype Boards And Assemblies
Full Product Box Build
Potting And Conformal Coating
Complete, Turnkey Production
Payment & Shipping Terms:
|Material:||PI / PET||Stypes:||Rigid-Flex|
|Thickness:||1.6mm||Surface Finishing:||Immersion Gold|
Rigid-Flex PCB Assembly Circuit Board With 2-Layers ENIG Material Solder Mask Color Yellow,Blue,Green Services
Welcome to Huaswin!
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.
Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.
We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP
assembly ,IC pre-programming / burning on-line, testing, packing.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCB Assembly services:
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Hand Assembly and Soldering
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
|Assembly details||SMT and Thru-hole, ISO SMT and DIP lines|
|Lead Time||Prototype: 15 work days. Mass order: 20~25 work days|
|Testing on products||Flying Probe Test, X-ray Inspection, AOI Test, Functional test|
|Quantity||Min quantity: 1pcs. Prototype, small order, mass order, all OK|
|Files needed||PCB: Gerber files(CAM, PCB, PCBDOC)|
|Components: Bill of Materials(BOM list)|
|Assembly: Pick-N-Place file|
|PCB Panel Size||Min size: 0.25*0.25 inches(6*6mm)|
|Max size: 20*20 inches(500*500mm)|
|PCB Solder Type||Water Soluble Solder Paste, RoHS lead free|
|Components details||Passive Down to 0201 size|
|BGA and VFBGA|
|Leadless Chip Carriers/CSP|
|Double-sided SMT Assembly|
|Fine Pitch to 0.8mils|
|BGA Repair and Reball|
|Part Removal and Replacement|
|Component package||Cut Tape,Tube,Reels,Loose Parts|
|Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing|
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray provides high-resolution inspection of:
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
Advanced Function Test
Flash Device Programming
Huaswin’s production facility is ISO9001 certified to ensure top quality production of your product!