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1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603,0402,0201components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Product Details:
Payment & Shipping Terms:
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Lead Free HASL PCB Board Assembly with Cables , 12 Layer / 16 Layer PCB
Quick Detail:
Detailed Specification of PCB Manufacturing
1 |
layer |
1-30 layer |
2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
3 |
Board thickness |
0.2mm-6mm |
4 |
Max.finished board size |
800*508mm |
5 |
Min.drilled hole size |
0.25mm |
6 |
min.line width |
0.075mm(3mil) |
7 |
min.line spacing |
0.075mm(3mil) |
8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
9 |
Copper thickness |
0.5-4.0oz |
10 |
Solder mask color |
green/black/white/red/blue/yellow |
11 |
Inner packing |
Vacuum packing,Plastic bag |
12 |
Outer packing |
standard carton packing |
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
15 |
Profiling punching |
Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
1 |
Type of Assembly |
SMT and Thru-hole |
2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
3 |
Components |
Passives Down to 0201 Size |
BGA and VFBGA |
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Leadless Chip Carries/CSP |
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Double-Sided SMT Assembly |
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Fine Pitch to 08 Mils |
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BGA Repair and Reball |
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Part Removal and Replacement-Same Day Service |
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3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
Largest:20x20 Inches |
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4 |
File Formats |
Bill of Materials |
Gerber Files |
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Pick-N-Place File(XYRS) |
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5 |
Type of Service |
Turn-Key,Partial Turn-Key or Consignment |
6 |
Component Packaging |
Cut Tape |
Tube |
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Reels |
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Loose Parts |
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7 |
Turn Time |
15 to 20 days |
8 |
Testing |
AOI inspection |
X-Ray inspection |
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In-Circuit testing |
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Functional test |