Huaswin Electronics Co.,Limited

Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China 

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Lead Free Hasl Surface Finish Through Hole PCB Assembly Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services

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Good quality PCB Board Assembly
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Through Hole PCB Assembly

  • High Precision Through Hole PCB Assembly suppliers

We provided both SMT and Through hole Assembly. 

Manual inserstion and Automatic insertion.

ICT testing to inspect all the through hole parts.

UL/ISO/ RoHS approval

Fast delivery, high quality, best after-sales service 

Through Hole PCB Assembly Sample Introduction

Lead Free Hasl Surface Finish Through Hole PCB Assembly Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services

China Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services Supplier
Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services Supplier Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services Supplier Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services Supplier

Large Image :  Lead Free Hasl Surface Finish Through Hole PCB Assembly Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services

Product Details:

Place of Origin: China
Brand Name: HUASWIN
Certification: ISO/UL/RoHS
Model Number: HSPCBA1894

Payment & Shipping Terms:

Minimum Order Quantity: 1 sets
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 15-20 working days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Detailed Product Description
Material: FR4 Surface Finishing: Lead Free HASL
Finished Thickness: 1.6mm Sold Mask: Green
Silkscreen: White Certification: Rohs,UL

PCB Assembly Lead Free Hasl Surface Finish Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services

 

 

Detailed Specification of PCB Manufacturing

 

1 layer 1-30 layer
2 Material CEM-1, CEM-3 FR-4, FR-4 High TG,
Polyimide,
Aluminum-based
material.
3 Board thickness 0.2mm-6mm
4 Max.finished board size 800*508mm
5 Min.drilled hole size 0.25mm
6 min.line width 0.075mm(3mil)
7 min.line spacing 0.075mm(3mil)
8 Surface finish HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,TS16949
15 Profiling punching Routing,V-CUT,Beveling


Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services
 
Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services
 
Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services
 
Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services
 
Lead Free Hasl Surface Finish Through Hole PCB Assembly  Copper 1OZ 1.6mm Thickness Selective Soldering Dip Services
Huaswin specialized in PCB manufacturing and and PCB Assembly
 
PCBA capabilities: 

  1. Fast prototyping
  2. High mix, low and medium volume build
  3. SMT MinChip:0201
  4. BGA: 1.0 to 3.0 mm pitch
  5. Through-hole assembly
  6. Special processes (such as conformal coating and potting)
  7. ROHS capability
  8. IPC-A-610E and IPC/EIA-STD workmanship operation

PCB Assembly services: 
 
SMT Assembly 

Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 

Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating

Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.
 
 
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 
 
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 
 
Quality Processes: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

 
 
Design file format:
 
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
 
Advantages:
 
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities 
 
 

Contact Details
Huaswin Electronics Co.,Limited

Contact Person: Ms. Vicky Lee

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