We are PCB & PCB assembly manufacturer with 15 years experience
100% QC inspection before Shipping.
Profeesional one-stop service release your energy to focus on design and marketing.
We provide a full range of testing services: AOI, Function Testing, In Circuit Testing, X-Ray for BGA
Sign NDA to keep your design safe
Payment & Shipping Terms:
|Finished Copper:||1 OZ||Silkscreen:||White|
Circuit Board Assembly FR4 Tg170 Material Copper 1OZ Rohs Bluetooth Electronics Applied With High Quality Best Services
Huaswin specialized in PCB manufacturing and and PCB Assembly
High mix, low and medium volume build
BGA: 1.0 to 3.0 mm pitch
Special processes (such as conformal coating and potting)
IPC-A-610E and IPC/EIA-STD workmanship operation
|2||Material||CEM-1, CEM-3 FR-4, FR-4 High TG,
|4||Max.finished board size||800*508mm|
|5||Min.drilled hole size||0.25mm|
|8||Surface finish||HAL, HAL Lead free,Immersion Gold/
Hard Gold, OSP
|10||Solder mask color||green/black/white/red/blue/yellow|
|11||Inner packing||Vacuum packing,Plastic bag|
|12||Outer packing||standard carton packing|
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before shipping. We'll test all of them according to your test procedure.
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 3D Paste Thickness Test
7. IC programing
Quotation Requirement :
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
7) Gerber file &BOM
Detailed Specification of PCB Manufacturing
PCB Assembly services:
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Hand Assembly and Soldering
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray provides high-resolution inspection of:
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
Advanced Function Test
Flash Device Programming
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949